Korean J Orthod.  2010 Feb;40(1):27-33. 10.4041/kjod.2010.40.1.27.

Shear bond strength between gold alloy and orthodontic metal bracket using light emitting diode curing light

• Jung MH
• Chung SH
• Shon WJ

• KMID: 1975621
• DOI: http://doi.org/10.4041/kjod.2010.40.1.27

Abstract

OBJECTIVE
The need to bond orthodontic brackets onto various alloys has increased because of the increasing demand for adult orthodontic treatment. This study tried to evaluate the shear bond strength between gold alloy and metal bracket using light emitting diode (LED) light curing after metal primer and silicoating surface conditioning.
METHODS
Half of the type III gold alloy plates were treated with sandblasting with aluminum oxide and metal primer containing 4-META, the other half were treated with silica and silane. Metal brackets were bonded with Transbond XT light curing adhesive on these plates and shear bond strength were evaluated 1 hour, 6 hours, and 24 hours later. The differences of shear bond strength between groups were evaluated with two-way ANOVA.
RESULTS
The results showed higher bond strength in the silicoating group and a tendency of bond strength increase over time.
CONCLUSIONS
When using LED curing lights for metal bracket bonding to alloy surfaces, long curing time and silicoating can produce a reliable bonding strength.

Keyword

Alloy surface; Shear bond strength; Metal primer; Silicoating

MeSH Terms

Adhesives
Adult
Alloys
Aluminum Oxide
Enzyme Multiplied Immunoassay Technique
Humans
Light
Methacrylates
Orthodontic Brackets
Resin Cements
Silicon Dioxide
Adhesives
Alloys
Aluminum Oxide
Methacrylates
Resin Cements
Silicon Dioxide

Figure

• 

  Fig 1 Alloy plates were embedded in cold curing acrylic and placed in acrylic rings. Each plate was oriented so that its surface would be parallel to the force during the shear bond test.

Reference

1. Jung MH. Current trends in orthodontic patients in private orthodontic clinics. Korean J Orthod. 2009. 39:36–42.

2. Keim RG, Gottlieb EL, Nelson AH, Vogels DS 3rd. 2008 JCO study of orthodontic diagnosis and treatment procedures, part 1: results and trends. J Clin Orthod. 2008. 42:625–640.

3. Newman GV. Epoxy adhesives for orthodontic attachments: progress report. Am J Orthod. 1965. 51:901–912.

4. Zachrisson BU. Graber TM, Vanarsdall RL, editors. Bonding in orthodontics. Orthodontics: current principles and techniques. 2000. 3rd ed. St. Louis: Mosby;557–646.

5. Proffit WR, Fields HW, Nixon WL. Occlusal forces in normal- and long-face adults. J Dent Res. 1983. 62:566–570.

6. Zachrisson BU, Buyukyilmaz T. Recent advances in bonding to gold, amalgam and porcelain. J Clin Orthod. 1993. 27:661–675.

7. Sperber R, Watson P, Rossouw P, Sectakof P. Adhesion of bonded orthodontic attachments to dental amalgam: in vitro study. Am J Orthod Dentofac Orthop. 1999. 116:506–513.

8. Lee YK, Cha JY, Yu HS, Hwang CJ. Effect of metal primer and thermocycling on shear bonding strength between the orthodontic bracket and gold alloy. Korean J Orthod. 2009. 39:320–329.

9. Nergiz I, Schmage P, Herrman W, Ozcan M. Effect of alloy type and surface conditioning on roughness and bond strength of metal brackets. Am J Orthod Dentofac Orthop. 2004. 125:42–50.

10. Mills RW, Jandt KD. Blue LEDs for curing polymer based dental filling materials. Lasers Electro-Opt Soc Inst Electr Electron Engr Newslet. 1998. 12:9–10.

11. Mills RW, Jandt KD, Ashworth SH. Dental composite depth of cure with halogen and blue light emitting diode technology. Br Dent J. 1999. 186:388–391.

12. Swanson T, Dunn WJ, Childers DE, Taloumis LJ. Shear bond strength of orthodontic brackets bonded with light-emitting diode curing units at various polymerization times. Am J Orthod Dentofacial Orthop. 2004. 125:337–341.

13. Krishnaswamy NR, Sunitha C. Light-emitting diode vs halogen light curing of orthodontic brackets: a 15-month clinical study of bond failures. Am J Orthod Dentofacial Orthop. 2007. 132:518–523.

14. Niepraschk M, Rahiotis C, Bradley TG, Eliades T, Eliades G. Effect of various curing lights on the degree of cure of orthodontic adhesives. Am J Orthod Dentofacial Orthop. 2007. 132:382–384.

15. Toroglu MS, Yaylali S. Effects of sandblasting and silica coating on the bond strength of rebonded mechanically retentive ceramic brackets. Am J Orthod Dentofacial Orthop. 2008. 134:181.e1–e181.e7.

16. Årtun J, Bergland S. Clinical trials with crystal growth conditioning as an alternative to acid-etch enamel pretreatment. Am J Orthod. 1984. 85:333–340.

17. Cook WD, Beech DR, Tyas MJ. Structure and properties of methacrylate based dental restorative materials. Biometerials. 1985. 6:362–368.

18. Kyldal KK, Ruyter IE. How different curing methods affect the degree of conversion of resin-based inlay/onlay materials. Acta Odontol Scand. 1994. 52:315–322.

19. Lee SJ. Effects of light source, exposure time and post-irradiation time on the degree of conversion and shear bond strength of orthodontic adhesive [PhD thesis]. 2003. Seoul, Korea: Graduate School, Seoul National University.

20. Stahl F, Ashworth SH, Jandt KD, Mills RW. Light-emitting diode (LED) polymerisation of dental composites: flexural properties and polymerisation potential. Biomaterials. 2000. 21:1379–1385.

21. Cheng L, Ferguson JW, Jones P, Wilson HJ. An investigation of the polymerization of orthodontic adhesives by the transillumination of tooth tissue. Br J Orthod. 1989. 16:183–188.

22. Ulusoy Ç, Irmak Ö, Bağiş Y, İlke O, Ulusoy A. Temperature rise and shear bond strength of bondable buccal tubes bonded by various light sources. Eur J Orthd. 2008. 30:413–417.

23. Bradburn G, Pender N. An in vitro study of the bond strength of two light-cured composites used in the direct bonding of orthodontic brackets to molars. Am J Orthod Dentofacial Orthop. 1992. 102:418–426.

24. Reynolds IR. A review of direct orthodontic bonding. Br J Orthod. 1975. 2:171–178.

25. Büyükyilmaz T, Zachrisson BU. Improved orthodontic bonding to silver amalgam. Part 2. Lathe-cut, admixed, and spherical amalgams with different intermediate resins. Angle Orthod. 1998. 68:337–344.

26. Tanaka T, Nagata K, Takeyama M, Atsuta M, Nakabayashi N, Masuhara E. 4-META opaque resin--a new resin strongly adhesive to nickel-chromium alloy. J Dent Res. 1981. 60:1697–1706.

27. Hansson O. Strength of bond with Comspan Opaque to three silicoated alloys and titanium. Scand J Dent Res. 1990. 98:248–256.

28. Peutzfeldt A, Asmussen E. Silicoating: evaluation of a new method of bonding composite resin to metal. Scand J Dent Res. 1988. 96:171–176.

29. Craig RG, Powers JM. Restorative dental materials. 2002. 11th ed. St. Louis: Mosby;67–124.

30. Büyükyilmaz T, Zachrisson Y, Zachrisson B. Improving orthodontic bonding to gold alloy. Am J Orthod Dentofacial Orthop. 1995. 108:510–518.

31. Reliance metal primer; instruction for use. Itaca: Reliance Orthodontic Products Inc..

32. Super-Bond C&B; Pictorial instruction for use. Moriyama, Japan: Sun Medical Co..

33. 3M ESPE Sil; instruction for use. St. Paul: 3M ESPE Dental Products.

34. Patusco VC, Montenegro G, Lenza MA, Alves de Carvalho A. Bond strength of metallic brackets after dental bleaching. Angle Orthod. 2009. 79:122–126.

35. Nebbe B, Stein E. Orthodontic brackets bonded to glazed and deglazed porcelain surfaces. Am J Orthod Dentofacial Orthop. 1996. 109:431–436.