Korean J Dent Mater.  2021 Sep;48(3):135-146. 10.14815/kjdm.2021.48.3.135.

The effect of agitation and evaporating time of a newly released universal adhesive on dentin bond strength

  • 1Department of Conservative Dentistry, School of Dentistry, Pusan National University, Yangsan, Republic of Korea
  • 2Dental and Life Science Institute, School of Dentistry, Pusan National University, Yangsan, Republic of Korea
  • 3Dental Research Institute, Pusan National University Dental Hospital, Yangsan, Republic of Korea


Universal adhesives that simplify bonding procedures and be used in multi-etch mode have been developed. In this study, the effects of agitation and solvent evaporation time of a universal adhesive on microtensile bond strength (µTBS) were evaluated by varying the times of these two procedures. Eighteen human molars were used to fabricate specimens, and the teeth were randomly divided into six experimental groups. Each group had different agitation time (5 s, 10 s, 20 s) and evaporation time (10 s, 20 s). The specimens were cut into a rod-shape with a cross-sectional area of 1 mm2 , and their µTBS was measured. The data were analyzed using an ANOVA and Tukey’s post hoc test. After this, the debonded surface was observed using scanning electron microscopy (SEM). In the groups with a solvent evaporation time of 20 s, µTBS was statistically higher, even with a short agitation time (p<0.05). Furthermore, for the groups with the shorter evaporation time, bonding strength decreased statistically as the agitation time shortened (p<0.05). The results of this experiment suggest that if the solvent was adequately evaporated, sufficient bonding strength could be obtained even when the adhesive was agitated for a short time. This is supported by the results of SEM image analysis, which revealed a uniform adhesive layer with well-infiltrated tags in the groups with the prolonged evaporation time. It may be crucial to secure an adequate evaporation time in order to obtain optimal bonding strength.


Agitation; Solvent evaporation; Universal adhesive; Microtensile bond strength; Scanning electron microscopy
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