J Korean Acad Pediatr Dent.  2019 Feb;46(1):57-63. 10.5933/JKAPD.2019.46.1.57.

Evaluation of High-power Light Emitting Diode Curing Light on Sealant Polymerization

• Park Y
• Lee J
• Ra J

• KMID: 2441497
• DOI: http://doi.org/10.5933/JKAPD.2019.46.1.57

Abstract

This study aimed to determine whether the curing times of Xtra Power and High Power modes of high-power light emitting diode (LED) curing light are sufficient for polymerization of resin sealants. The specimens were prepared and their microhardness values were measured and compared with those of specimens polymerized under conventional LED curing light. The filled sealant polymerized for 8 seconds in the High Power mode and for 3 seconds in the Xtra Power mode showed significantly lower microhardness than the control specimen (p = 0.000). The unfilled sealant polymerized for 8, 12 seconds in the High Power mode and for 6 seconds in the Xtra Power mode showed significantly lower microhardness than the control specimen (p = 0.000). The results of this study suggest that the short curing time with the Xtra Power and High Power modes of highpower LED curing light are not sufficient for adequate polymerization of sealants under specific conditions, taking into account the curing times and the type of sealant.

Keyword

Pit and fissure sealant; Light emitting diodes; Microhardness; Curing unit

MeSH Terms

Polymerization*
Polymers*
Polymers